A Substrate-less Process for Heterogeneous Integration of mm-Wave Circuits

نویسندگان

چکیده

Abstract In this paper, a new ultra-compact substrate-less approach to heterogeneous integration of millimeter wave circuits is demonstrated. the proposed process, active and passive components are placed face down on temporary carrier. A thick layer benzocyclobutene (BCB) deposited surrounding these using aerosol jet printing (AJP). This followed by combination blanket deposition silver conductor perforated BCB layers. allows for placement chips close each other leading integration. Also, front side made planar, which subsequent processing low-loss interconnects. Here, as proof concept, simple interconnect between two chips, other,

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ژورنال

عنوان ژورنال: Proceedings of the ... International Symposium on Microelectronics

سال: 2021

ISSN: ['1085-8024']

DOI: https://doi.org/10.4071/1085-8024-2021.1.000224